Silicon carbide (SiC) device with improved gate dielectric shielding

ABSTRACT

In one general aspect, an apparatus can include a silicon carbide (SiC) device can include a gate dielectric, a first doped region having a first conductivity type, a body region of the first conductivity type, and a second doped region having a second conductivity type. The second doped region has a first portion disposed between the first doped region and the body region, and the second doped region has a second portion disposed between the first doped region and the gate dielectric.

RELATED APPLICATION

This application claims priority to and the benefit of U.S. ProvisionalPatent Application No. 62/096,949, filed on Dec. 26, 2014, and entitled“A Silicon Carbide (SiC) Device with Improved Gate DielectricShielding”, which is incorporated herein by reference in its entirety.

TECHNICAL FIELD

This description relates to a silicon carbide (SiC) device with improvedgate dielectric shielding.

BACKGROUND

Known devices in silicon carbide (SiC) are vulnerable to breakdownacross a gate dielectric. Known solutions for handling this type ofbreakdown do not yield desirable results. Thus, a need exists forsystems, methods, and apparatus to address the shortfalls of presenttechnology and to provide other new and innovative features.

SUMMARY

In one general aspect, an apparatus can include a silicon carbide (SiC)device can include a gate dielectric, a first doped region having afirst conductivity type, a body region of the first conductivity type,and a second doped region having a second conductivity type. The seconddoped region has a first portion disposed between the first doped regionand the body region, and the second doped region has a second portiondisposed between the first doped region and the gate dielectric.

The details of one or more implementations are set forth in theaccompanying drawings and the description below. Other features will beapparent from the description and drawings, and from the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram that illustrates a side cross-sectional view of asilicon carbide (SiC) device.

FIGS. 2A and 2B are graphs that illustrate doping concentrations alonglines in FIG. 1.

FIGS. 3A and 3B are additional graphs that illustrate dopingconcentrations along lines in FIG. 1.

FIGS. 4A and 4B are graphs that illustrate electric fields included indevices.

FIGS. 5A and 5B are diagrams that illustrate, respectively, draincurrent density and maximum electric field versus drain to sourcevoltage.

FIG. 6 is a top cross-sectional view of a SiC device.

DETAILED DESCRIPTION

FIG. 1 is a diagram that illustrates a side cross-sectional view of aportion of a silicon carbide device 100 (which can be a SiC power deviceor a SiC high voltage device). The SiC device 100 includes features thatenhance shielding of a gate dielectric 110 (e.g., a gate oxide (e.g., athermal oxide, a deposited oxide), a high-K dielectric) of the SiCdevice 100. Accordingly, the SiC device 100 can be referred to as aFully shielded Field Effect Transistor (FullFET). As shown in FIG. 1,the SiC device 100 includes a gate 120 (having a gate contact 124)disposed over the gate dielectric 110, a source 130 (which can include asource contact 134 and a source region 135). The SiC device 100 alsoincludes a drain 140 (which can include a drain contact 144 and a drainregion 145) disposed on a backside of the SiC device 100 such that anepitaxial layer 150 (also can be referred to as an epitaxial region oras a drain epitaxial) and/or a substrate 155 are disposed between thesource 130 (or gate 120) and the drain 140. Although only some (or aportion) of the elements of the SiC device 100 are shown or labeled, theelements of the SiC device 100 are, or can be, mirrored.

As shown in FIG. 1, a P-type doped region 170 (which can be referred toas a P-type shield or P-type shield region) is disposed below the gatedielectric 110 such that an N-type doped region 160 has a first portion162 disposed between the P-type doped region 170 and the gate dielectric110. Also, a P-type body region 180 is included in the SiC device 100such that an N-type doped region 160 has a second portion 164 disposedbetween the P-type body region 180 and the P-type doped region 170. Athird portion 166, mirrored on the opposite side of the P-type dopedregion 170 relative to the second portion 164, is included in the N-typedoped region 160. As shown in FIG. 1, the first portion 162 ishorizontally aligned, or aligned along a direction that is the same as adirection along which the gate dielectric 110 or a top surface of theSiC device 100 is aligned. The second portion 164 is horizontallyaligned or aligned along a direction between the source 130 (or gate120) and the drain 140. In some implementations, a portion of the P-typedoped region 170 may not be disposed or extend below or under (e.g., maybe excluded from being below or under) the second portion 164 of theN-type doped region 160.

In some implementations, the SiC device 100 can be a relatively highvoltage device operating at voltages greater than 400 V (e.g., 1000 V,1200 V, 1500 V). In some implementations, the SiC device 100 can be adouble-diffused metal-oxide-semiconductor (DMOS) device (e.g., verticalDMOS device).

In some implementations (and as shown in FIG. 1), a depth of the N-typedoped region 160 can be approximately an equal depth as the P-type doperegion 170 in the SiC device 100 (from a top of the epitaxial layer 150or bottom surface of the gate dielectric 110). In some implementations,a depth of the N-type doped region 160 can be less than or greater thana depth as the P-type doped region 170 in the SiC device 100 (from a topof the epitaxial layer 150 or bottom surface of the gate dielectric110).

As shown, a distance (e.g., a depth, a thickness) of the first portion162 of the N-type doped region 160 is greater than a distance D2 (e.g.,a depth, a thickness) of the second portion 164 of the N-type dopedregion 160. In some implementations, the depth D1 of the first portion162 is greater than the distance D2 of the second portion 164. In someimplementations, a ratio of the distance D1 to the distance D2 can begreater than 1 (e.g., 1.5:1, 2:1, 3:1, 4:1, 5:1, etc.). In someimplementations, a distance D3 (e.g., a depth, a thickness) of theP-type doped region 170 is greater than the distance D2 of the firstportion 162.

In some implementations, the first portion 162 has a top surface incontact with a bottom surface of the gate dielectric 110. In someimplementations, the second portion 164 has a top surface in contactwith a bottom surface of the gate dielectric 110. In someimplementations, the first portion 162 can have a top surface disposedwithin a same plane as a top surface of the second portion 164. In someimplementations, the first portion 162 and the second portion 164 caneach have a top surface aligned with (or disposed within a same planeas) a top surface of the P-type body region 180.

As shown, a width W1 of the second portion 164 of the N-type dopedregion 160 is less than a width W2 of the P-type doped region 170. Insome implementations, the width W1 of the second portion 164 of theN-type doped region 160 is equal to half of the width W2 of the P-typedoped region 170. In some implementations, the width W1 of the secondportion 164 of the N-type doped region 160 is greater than or less thanhalf of the width W2 of the P-type doped region 170.

In some implementations, the width W1 and/or W2 can be less than 1 μm(e.g., 0.25 μm, 0.5 μm) or can be greater than 1 μm (e.g., 2 μm, 5 μm).As shown in FIG. 1, a width W3 of the gate contact 124 can be greaterthan the width W1 and/or the width W2. The width W3 can be a micron ormore (e.g., 2 μm, 5 μm, 10 μm,).

As shown in FIG. 1, the gate contact 124 and gate dielectric 110 extendover the source region 135. In some implementations, the gate dielectric110 can be aligned along a plane. A doping concentration of P-type dopedregion 170 can have a concentration higher than a doping concentrationof the second portion 164 of the N-type doped region 160. In someimplementations, the SiC device 100 can exclude a buried channel.

Although not shown in FIG. 1, the elements of the portion of the SiCdevice 100 can be mirrored to form a larger device or included withother semiconductor devices. In other words, the portion of the SiCdevice 100 can be approximately a half-cell. Said differently, theportion of the SiC device 100 can be one side of a larger or completeSiC device. In some implementations, termination regions or structurescan be included in the SiC device 100.

Although not shown explicitly in FIG. 1, in some implementations, theP-type doped region 170 can be electrically coupled to a sourcepotential (e.g., a potential of the source 130). The P-type doped region170 can be tied to a same potential as the P-type body region 180. Insome implementations, the P-type doped region 170 can be electricallyfloating. In some implementations the P-type doped region 170 can have adoping concentration in the range of 1e18 to 1e19 cm⁻³.

In some implementations, a shape of the N-type doped region 160 and/orof the P-type doped region 170 can be different than shown in FIG. 1.For example, at least a portion of the N-type doped region 160 and/or atleast a portion of the P-type doped region 170 can have a circularshape, a triangular shape, can have curves or sloped portions, and/or soforth. In this implementation, the P-type doped region 170 has abox-shaped or rectangular-shaped profile. In some implementations, theN-type doped region 160 and/or the P-type doped region 170 can beincluded in a region of the SiC device 100 that can be referred to as ajunction field-effect transistor (JFET) region.

In this implementation, a doping level (or doping concentration) of theN-type doped region 160 can be higher than a doping level (or dopingconcentration) in the epitaxial layer 150. In some implementations, thedoping level of the N-type doped region 160 can be more than two timesthe doping level of the epitaxial layer 150.

In some implementations, manufacturing of the SiC device 100 can befacilitated by the doping level of the N-type doped region 160 beingrelatively high compared to the doping level of the epitaxial layer 150.The N-type doped region 160 can be formed using a doping process (e.g.,an ion implant process or an epitaxial growth process). The N-type dopedregion 160 can be formed before or after formation of the gatedielectric 100. The P-type doped region 170 can be formed using a dopingprocess (e.g., an ion implant process) through the first portion 162 ofthe N-type doped region 160. The relatively high dopant of the N-typedoped region 160 can facilitate formation of a shape (e.g., arectangular region) of the P-type doped region 170 and/or can ensurethat the portion (e.g., the first portion 162) between the P-type dopedregion 170 and the gate dielectric 110 remains an N-type region. TheP-type doped region 170 can be formed below (e.g., immediately below) alocation of probability of high electric field (e.g., maximum electricfield). The location of probability of relatively high electric fieldcan be toward a center portion 112 or a middle portion of the gatedielectric 110.

In some implementations, a thickness (e.g., vertical thickness) of theepitaxial layer 150 can be several times (e.g., 5 times, 10 times, 20times) smaller than a thickness of the substrate 155. In someimplementations, a thickness of the epitaxial layer 150 can be a fewmicrons (μm) (e.g., 5 μm, 10 μm, 20 μm) in thickness. In someimplementations, a thickness of the substrate 155 can have a thicknessof approximately 100 microns (μm) or more (e.g., 150 μm, 250 μm, 350 μm,500 μm). In some implementations, the thickness of the epitaxial layer150 can be less than a few microns and/or the thickness of the substrate155 can be less than 100 microns.

The configuration of the N-type doped region 160 (e.g., relatively highdoping level of the N-type doped region 160) in combination with theP-type doped region 170 (e.g., the P-type doped region 170 below thefirst portion 162 of the N-type doped region 160 and the gate dielectric110) within the SiC device 100 shown in FIG. 1 can have severaladvantages. In some implementations, these features provide anadditional degree of freedom for reducing the electric field (e.g.,maximum electric field) in the gate dielectric 110 since the p-typedoped region 170 is in relatively close proximity to the location of thehigh oxide electric field (e.g., below the gate dielectric 110 andseparated from the gate dielectric 110 by the first portion 162 of theN-type doped region 170 and toward the center portion 112 (or middleportion) of the gate dielectric 110, which is on the far right side ofthe SiC device 100 shown in FIG. 1). In some implementations, thesefeatures can reduce relatively high E-fields that can be formed at(e.g., across, near) the gate dielectric 110 during operation of the SiCdevice 100 (e.g., during relatively high voltage blocking operation). Insome implementations, these features can reduce on resistance of the SiCdevice 100 by reducing potential JFET effects. In some implementations,these features can reduce gate-to-drain capacitance, which canfacilitate faster switching of the SiC device 100. In someimplementations, these features can result in an improvement in thetrade-off between on-resistance and maximum oxide electric field duringhigh voltage blocking compared with known technologies.

In some implementations, the features of the SiC device 100 describedherein can have advantages over shielding that may be implemented by,for example, deep P-type body regions (not shown). Also, the features ofthe SiC device 100 described herein can have advantages over interruptedor split gate configurations (not shown). Such interrupted gateconfigurations can introduce complexity (e.g., interrupted gate contactsor electrodes) and/or uncontrolled and undesirable surface potentials.

The conductivity types that are described in connection with FIG. 1, orany of the other figures described herein, can be reversed. In otherwords, regions that are doped with a P-type dopant can be exchanged foran N-type dopant, and regions that are doped with an N-type dopant canbe exchanged for a P-type dopant.

In some implementations, the width W1 of the second portion 164 underthe gate 124 can be particularly significant. For a given width W1 ofthe second portion 164 the N-type doping concentration for the secondportion 164 can be defined. For a smaller width W1, a higher N-typedoping concentration of the second portion 164 can be needed.Conversely, for a smaller width W1, a higher N-type doping concentrationof the second portion 164 can be needed. More details regarding dopingconcentrations are shown and discussed in connection with at least FIGS.2A through 3B.

FIG. 2A is a graph that illustrates doping concentrations for P-type andN-type along line A1 in FIG. 1. FIG. 2B is a graph that illustratesdoping concentrations for P-type and N-type along line A2 in FIG. 1.Although dimensionless in FIGS. 2A and 2B, the distances can bemultiples of microns in some implementations.

In the graph shown in FIG. 2A, the P-type dopant concentration increasesfrom a depth of 0 (e.g., 0 μm, or a multiple thereof) to a peak dopantconcentration at approximately 0.6 (e.g., 0.6 μm, or a multiplethereof). In some implementations, the peak dopant concentration can beat a different depth. The N-type doping concentration is approximatelyat a constant level until a depth of approximately 1 (e.g., 1 μm, or amultiple thereof). The doping concentration within this SiC device 100is contrasted with an N-type doping concentration in a typical MOSFETdevice.

As shown in FIG. 2A, the SiC device 100 has a buried P-doped regionunder the center of the gate (or gate dielectric 110) and N-type dopedregion 160 with increased dopant concentration above the P-type dopedregion 170 and extending to the channel and in a downward direction. TheP-type doped region 170 reduces the maximum electric field in the gatedielectric 110 and the N-type doped region 160 reduces potential JFETeffects. In some implementations, the P-type doped region 170 can beelectrically coupled to the source 130 in relatively small die areas.This concept is discussed in more detail below.

FIG. 2B is a graph that illustrates doping concentrations for P-type andN-type along line A2 in FIG. 1. As shown in FIG. 2B, a P-type doping isexcluded from (or negligible in) the second portion 164 of the N-typedoped region 160 along line A2.

The doping concentration and depths in FIGS. 2A and 2B are illustratedby way of example only. In some implementations, concentration profiles,depths, and/or so forth can be different than shown in FIGS. 2A and 2B.

FIGS. 2A and 2B are graphs that illustrate N-type doping concentrationsthat are relatively (e.g., substantially) constant or uniform or linearalong a depth direction. The P-type doping concentration is non-uniform(e.g., Gaussian). In some implementations, the P-type dopingconcentration can be relatively constant or uniform or linear. FIGS. 3Aand 3B are graphs that illustrate an N-type doping concentration profileand/or a P-type doping concentration that are non-uniform ornon-constant or non-linear along a depth direction.

FIG. 3A is an additional graph that illustrates doping concentrationsfor P-type and N-type along line A1 in FIG. 1. FIG. 3B is a graph thatillustrates doping concentrations for P-type and N-type along line A2 inFIG. 1.

In graph shown in FIG. 3A, the P-type dopant concentration increasesfrom a depth of 0 (e.g., 0 μm, or a multiple thereof) to a peak dopantconcentration at approximately 0.6 (e.g., 0.6 μm, or a multiplethereof). The N-type doping concentration increases from a depth of 0(e.g., 0 μm, or a multiple thereof) to a peak dopant concentration atapproximately 0.6 (e.g., 0.6 μm, or a multiple thereof). In someimplementations, the peak for the N-type doping or the peak for theP-type doping can be aligned as shown, or can be different. Accordingly,the net doping concentration along A1 can be relatively (e.g.,substantially) constant or uniform or linear along the depth direction.In some implementations, the net doping concentration along A1 can be ata relatively uniform N-type doping concentration of approximately 1e16cm⁻³ for the drain and JFET region of, for example, a 1200 V SiC MOSFETdevice. The doping concentration within this SiC device 100 iscontrasted with an N-type doping concentration in a typical MOSFETdevice.

As shown in FIG. 3A, the SiC device 100 has a buried P-doped regionunder the center of the gate (or gate dielectric 110) and N-type dopedregion 160 with increased dopant concentration above the P-type dopedregion 170 and extending to the channel and in a downward direction. TheP-type doped region 170 reduces the maximum electric field in the gatedielectric 110 and the N-type doped region 160 reduces potential JFETeffects. In some implementations, the P-type dope region 170 can beelectrically coupled to the source 130 in relatively small die areas.This concept is discussed in more detail below.

FIG. 3B is an additional graph that illustrates doping concentrationsfor P-type and N-type along line A2 in FIG. 1. As shown in FIG. 3B, aP-type doping is excluded from (or negligible in) the second portion 164of the N-type doped region 160 along line A2.

FIG. 4A is a graph that illustrates electric fields within an exampleMOSFET device, and FIG. 4B is a graph that illustrates electric fieldswithin a SiC devices described herein. Although dimensionless in FIGS.4A and 4B, the distances can be multiples of microns in someimplementations. In these graphs, distances illustrated on the x-axis inmicrons and electric field is illustrated on the y-axis in volts percentimeter. The drain to source voltage for both is the same atapproximately 1200 V.

The electric fields shown in FIG. 4B correspond with points B1 (atapproximately the right edge of the P-type body region 180), B2, and B3(at approximately the center of the gate 120) along the MOS gateillustrated in FIG. 2A. In some implementations, the P-type doped region170 can have a half-cell width of approximately 500 nm (full width ofapproximately 1 micron). The electric fields shown in FIG. 4A correspondwith locations B1′, B2′, and B3′ in a MOS gate in a conventional MOSFETdevice (not shown and without the additional features described herein)with dimensions similar to the MOS gate of the SiC device 100illustrated in FIG. 1. These graphs are presented by way of exampleonly, and different profiles and dimensions may be used in differentdevice configurations.

As shown in FIG. 4A, a maximum electric field in the MOSFET device is atapproximately a center portion (e.g., location B3′) of the MOS gate ofthe MOSFET device. As shown in FIG. 4B, a maximum electric field in theSiC device 100 is approximately at location B2 of the SiC device 100(e.g., which is at approximately a left edge of the P-type doped region170).

FIGS. 5A and 5B are diagrams that illustrate, respectively, draincurrent density (A/cm²) and maximum electric field (V/cm) versus drainto source voltage (V) for variations of the SiC device 100 shown in FIG.1 compared with a corresponding MOSFET device (not shown). Asillustrated in FIG. 5A, the SiC device 100 with a 1000 nm wide P-typedoped region 170 has approximately a 25% reduced on-resistance comparedto a MOSFET device. As illustrated in FIG. 5B, the SiC device 100 with a1000 nm wide P-type doped region 170 has approximately a 64% reducedmaximum electric field in gate oxide compared to a MOSFET device.

The on-resistance of the SiC device 100 changes a relatively smallamount in response to the width of the P-type doped region 170. Thiseffect can be because the JFET resistance is reduced to a relatively lowlevel. The gate-drain capacitance is reduced for the SiC device 100compared to the MOSFET device. Although illustrated as having specificcharacteristics (e.g., dimensions), various characteristics can beimplemented. The specific characteristics are presented by way ofexample only.

FIG. 6 is a top cross-sectional view of a SiC device 300. As shown inFIG. 6, the SiC device 300 includes an N-type doped region 364 (whichcan correspond to the second portion 164 of the N-type doped region 160)disposed between the P-type doped region 370 and a P-type body region380. The SiC device 300 includes a source region 335 and a P+ region 337(which are associated with a source 330). The P+ region 337 is coupledto (e.g., electrically or conductively coupled to) the P-type dopedregion 370 by a connection portion 392.

The P-type doped region 370 can be coupled to the P+ region 337 andsource region 335 at various places along the SiC device 300. The gate320 (but not the gate electrode) may be interrupted at various placessuch that the P-type doped region 370 may be coupled to the source 330.In some implementations, approximately 5-10% or less of the SiC device300 may be used to make connections between the P-type doped region 370and the source 330. In some implementations, no low-resistive pathand/or high direct-current (DC) capable metal connection may be neededfor the p-type doped region 370.

Although the behavior of the circuits shown and described in the graphsherein as making transitions at specified voltages and at specifiedtimes, when implemented, the transitions of components may occurslightly before or slightly after the specified voltages, specifiedtimes, and/or so forth. Specifically, variations in threshold voltages,processing variations, temperature variations, switching speeds ofdevices, circuit transition delays, and/or so forth can result inconditions (e.g., non-ideal conditions) that can trigger transitions ofcomponents slightly before or slightly after the specified voltages,times, and/or so forth.

It will also be understood that when an element, such as a layer, aregion, or a substrate, is referred to as being on, connected to,electrically connected to, coupled to, or electrically coupled toanother element, it may be directly on, connected or coupled to theother element, or one or more intervening elements may be present. Incontrast, when an element is referred to as being directly on, directlyconnected to or directly coupled to another element or layer, there areno intervening elements or layers present. Although the terms directlyon, directly connected to, or directly coupled to may not be usedthroughout the detailed description, elements that are shown as beingdirectly on, directly connected or directly coupled can be referred toas such. The claims of the application may be amended to reciteexemplary relationships described in the specification or shown in thefigures.

As used in this specification, a singular form may, unless definitelyindicating a particular case in terms of the context, include a pluralform. Spatially relative terms (e.g., over, above, upper, under,beneath, below, lower, and so forth) are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. In some implementations, therelative terms above and below can, respectively, include verticallyabove and vertically below. In some implementations, the term adjacentcan include laterally adjacent to or horizontally adjacent to.

Implementations of the various devices (e.g., SiC device 100, and soforth) described herein can be included in a variety of devices orsystems such as, for example, an electronic device. The electronicdevice can be, or can include, for example, a laptop-type device with atraditional laptop-type form factor. In some implementations, theelectronic device can be, or can include, for example, a wired deviceand/or a wireless device (e.g., Wi-Fi enabled device), a computingentity (e.g., a personal computing device), a server device (e.g., a webserver), a mobile phone, an audio device, a motor control device, apower supply (e.g., an off-line power supply), a personal digitalassistant (PDA), a tablet device, e-reader, a television, an automobile,and/or so forth. In some implementations, the electronic device can be,or can include, for example, a display device (e.g., a liquid crystaldisplay (LCD) monitor, for displaying information to the user), akeyboard, a pointing device (e.g., a mouse, a trackpad, by which theuser can provide input to the computer).

Some implementations may be implemented using various semiconductorprocessing and/or packaging techniques. Some implementations may beimplemented using various types of semiconductor processing techniquesassociated with semiconductor substrates including, but not limited to,for example, Silicon (Si), Gallium Nitride (GaN), and/or so forth.

While certain features of the described implementations have beenillustrated as described herein, many modifications, substitutions,changes and equivalents will now occur to those skilled in the art. Itis, therefore, to be understood that the appended claims are intended tocover all such modifications and changes as fall within the scope of theimplementations. It should be understood that they have been presentedby way of example only, not limitation, and various changes in form anddetails may be made. Any portion of the apparatus and/or methodsdescribed herein may be combined in any combination, except mutuallyexclusive combinations. The implementations described herein can includevarious combinations and/or sub-combinations of the functions,components and/or features of the different implementations described.

What is claimed is:
 1. An apparatus, comprising: a silicon carbide (SiC)device can include a gate dielectric; a first doped region having afirst conductivity type; a source; a body region of the firstconductivity type; and a second doped region having a secondconductivity type, the second doped region having a first portiondisposed between the first doped region and the body region, the seconddoped region having a second portion disposed between the first dopedregion and the gate dielectric, the first doped region being under thegate dielectric.
 2. The apparatus of claim 1, wherein the first portionof the second doped region is aligned horizontally between the bodyregion and the first doped region, and the second portion of the seconddoped region is aligned vertically between the gate dielectric and thefirst doped region.
 3. The apparatus of claim 1, wherein the firstportion of the second doped region is contiguous with the second portionof the second doped region.
 4. The apparatus of claim 1, wherein the SiCdevice can include an epitaxial layer of the second conductivity type,and the second portion of the second doped region is included in ajunction field-effect transistor (JFET) region.
 5. The apparatus ofclaim 4, wherein the second portion of the second doped region has adoping concentration greater than a doping concentration of theepitaxial layer.
 6. The apparatus of claim 1, wherein the first dopedregion is coupled to a source potential.
 7. The apparatus of claim 1,wherein the first doped region is floating.
 8. The apparatus of claim 1,wherein the body region is a first body region on a first side of agate, the apparatus, further comprising: a second body region disposedon a second side of the gate, the second doped region having a thirdportion disposed between the first doped region and the second bodyregion.
 9. The apparatus of claim 8, wherein the third portion of thesecond doped region is aligned horizontally between the second bodyregion and the first doped region.
 10. The apparatus of claim 8, whereinthe first portion of the second doped region is contiguous with thesecond portion of the second doped region and the third portion of thesecond doped region.
 11. The apparatus of claim 1, wherein the firstportion is formed using an ion implantation process.
 12. An apparatus,comprising: a silicon carbide (SiC) device can include a gatedielectric; a first doped region having a first conductivity type; abody region; a source region; and a second doped region having a secondconductivity type, the second doped region having a first portiondisposed between the first doped region and the source region, thesecond doped region having a second portion disposed between the firstdoped region and the gate dielectric, the first portion having asubstantially constant net doping concentration along a depth direction,the first doped region being under the gate dielectric.
 13. Theapparatus of claim 12, wherein the first portion of the second dopedregion is aligned horizontally between the source region and the firstdoped region, and the second portion of the second doped region isaligned vertically between the gate dielectric and the first dopedregion.
 14. The apparatus of claim 12, wherein the first portion of thesecond doped region is contiguous with the second portion of the seconddoped region.
 15. The apparatus of claim 12, wherein the SiC device caninclude an epitaxial layer of the second conductivity type, and thesecond portion of the second doped region is included in a junctionfield-effect transistor (JFET) region.
 16. The apparatus of claim 15,wherein the second portion of the second doped region has a dopingconcentration greater than a doping concentration of the epitaxiallayer.
 17. The apparatus of claim 12, wherein the first doped region iscoupled to a source potential.
 18. The apparatus of claim 12, whereinthe first doped region is floating.
 19. The apparatus of claim 12,wherein the body region is a first body region on a first side of agate, the apparatus, further comprising: a second body region disposedon a second side of the gate, the second doped region having a thirdportion disposed between the first doped region and the second bodyregion.
 20. The apparatus of claim 19, wherein the third portion of thesecond doped region is aligned horizontally between the second bodyregion and the first doped region.